Each .bxl file contains both a schematic symbol and at least one footprint (exception for custom formed lead devices which have no footprint). The .stp file, if available, contains a 3D STEP model. With the exception of DSBGA, QFN, and SON packages which only have one footprint, the footprints in the .bxl are available in three sizes per the IPC-7351 standard for the least, nominal, and most real estate on the PCB. The naming convention for the files is as follows:
| Name |
Description |
| xxxxxx |
Nominal footprint (nominal packing density) |
| xxxxxx-L |
Least footprint (highest packing density) |
| xxxxxx-M |
Maximum footprint (lowest packing density) |
For more information on the IPC-7351 standard visit IPC Review
For more information on Cad Tools visit CAD/CAE Symbols
Provided by Accelerated Designs Inc. & the Ultra Librarian
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